Following the dismantling of the Apple iPhone 11 Pro Max by iFixit, another foreign analysis agency Techinsights recently dismantled the Apple iPhone 11 Pro Max, analyzing the main components and the overall BOM cost. According to Techinsights' analysis, the total BOM cost of the iPhone 11 Pro Max (512GB version) is US$490.5 (rounded to the nearest US$0.5), equivalent to RMB 3,493, which is only 27.5% of the RMB 12,699 price of the domestic version. It can be seen that the cost of the rear triple-camera module of the iPhone 11 Pro Max accounts for the highest proportion of the total cost, reaching about 15%, which is $73.5. The second largest cost is the display and touch screen ($66.5) and the A13 processor ($64). The BOM cost of the previous iPhone Xs Max (256GB version) was about $453, while that of the iPhone 11 Pro Max (512GB version) increased by $57.5. Among the costs of the iPhone Xs Max, the screen accounts for the highest cost, which is $90.5, followed by the A12 RF/baseband ($72), the flash memory chip (256GB version) is $64.5, and the camera costs only $44. ▲ BOM cost of iPhone Xs Max (256GB version) That is to say, the cost of the new iPhone 11 Pro Max has dropped significantly in terms of screen and storage, but the cost of the camera, processor + baseband has increased significantly. In particular, the cost of the camera has increased significantly by $29.5. The Apple A13 processor inside the iPhone 11 Pro Max disassembled by Techinsights is numbered APL1W85. The A13 processor and Samsung K3UH5H50AM-SGCL 4GB LPDDR4X SDRAM are packaged together via PoP, with the same 4GB DRAM capacity as last year's previous iPhone Xs Max. It is worth mentioning that the iPhone 11 Pro Max previously disassembled by iFixit uses the SK Hynix H9HKNNNCRMMVDR-NEH LPDDR4X memory chip. The size of the A13 processor (die seal edge) is 10.67mm x 9.23mm = 98.48 mm², which is an 18.27% increase in size compared to the previous A12. Samsung K3UH5H50AM-SGCL 4GB LPDDR4X SDRAM features 4 identical 1y nm dies. As expected, Intel provides the baseband chip for iPhone 11, numbered as PMB9960, which may be the XMM7660 modem. According to information previously released by Intel, the XMM7660 is based on a 14nm process and is its sixth-generation LTE modem that meets 3GPP Release 14. It supports speeds of up to 1.6 Gbps in the downlink (Cat.19) and up to 150 Mbps in the uplink. In comparison, the previous iPhone Xs Max uses the Intel PMB9955 XMM7560 modem, which supports up to 1 Gbps in the downlink (Cat.16) and up to 225 Mbps in the uplink (Cat.15). This may be the last time we see Intel mobile chipsets in the iPhone since Intel officially withdrew from the smartphone baseband chip business. Because Apple settled with Qualcomm at the beginning of this year and reached a new patent licensing agreement. In addition, in July of this year, Apple also reached an agreement with Intel to acquire Intel's baseband chip business for US$1 billion. Therefore, even if the new iPhone next year is not Apple's self-developed 5G baseband chip, it will be Qualcomm's 5G baseband chip. In terms of RF devices, iFixit's previous disassembly showed that the iPhone 11 Pro Max uses:- Avago 8100 Mid/High Band PAMiD Module
- Skyworks 78221-17 Low-Band PAMiD Module
- Intel 5765 P10 A15 08B13 H1925 transceiver
- Skyworks 78223-17 Power Amplifier
- Qorvo 81013 Packet Tracking Module
- Skyworks 13797-19 DRx Module
The RF-related devices inside the iPhone 11 Pro Max disassembled by Techinsights are exactly the same. Among them, Intel PMB5765 is an RF transceiver that can be used with Intel modems. In terms of power management ICs, the iPhone 11 Pro Max has an Intel 6840 P10 409 H1924 baseband power management IC that is compatible with the baseband chip; Apple's own main PMIC 343S00355 (APL1092) designed for the A13 Bionic; Apple 338S00510, Apple 338S00510; Texas Instruments TPS61280 battery DC/DC converter; STMicroelectronics STB601; Texas Instruments SN2611A0 battery charger, Samsung S2DOS23 display power management, etc. ▲Intel 6840 P10 409 H1924 baseband power management IC It is particularly worth mentioning that the iPhone 11 series also added a module numbered USI, which is likely to contain the Apple U1 chip. Apple says its newly designed U1 chip uses ultra-wideband technology to achieve spatial awareness, allowing the iPhone 11 Pro to accurately locate other Apple devices also equipped with U1. This is like adding another sensory ability to the iPhone, which will bring many exciting new features. With the U1 chip and iOS 13, when using AirDrop, just point your iPhone at someone else's iPhone and the system will prioritize them, allowing you to share files faster. Then it can be understood that the U1 chip is similar to the W1 chip and H1 chip that Apple previously used in AirPods wireless headphones. It is a chip that provides spatial perception and more precise positioning. Apple says the first app to take advantage of the new chip is Apple's AirDrop app. With the iOS 13.1 update, which will roll out on September 30, AirDrop will get better with direction-aware suggestions. You can point your iPhone at someone else and AirDrop will prioritize that device so you can share files faster. Apple also said it will launch more advanced apps based on the U1 chip in the coming months. The 512GB version of the iPhone 11 Pro Max disassembled by Techinsights uses a Toshiba 512 GB NAND flash memory module. The Wi-Fi/Bluetooth module equipped in this iPhone 11 Pro Max is Murata 339S00647. Techinsights speculates that it may be equipped with Broadcom Wi-Fi 6/BT 5.0 wireless combination IC BCM4375. NXP has once again won an order for Apple's iPhone with its new SN200 NFC&SE module. The wireless charging chip used is STMicroelectronics STPMB0 933ANH HQHQ96 170721G. This may also mean that Broadcom has lost the order for Apple's iPhone wireless charging chip. Apple's 18W charger and the four chips in it The iPhone 11 Pro Max comes with the Apple 1720 18W USB-C power charger. The device is rated for 5V/3A or 9V/2A. Here are the four chips inside the charger: For the first time, the iPhone 11 Pro Max is equipped with a rear triple-camera, consisting of a 12-megapixel wide-angle (f/1.8) lens + a 12-megapixel telephoto (f/2.2) lens + a 12-megapixel ultra-wide-angle (f/2.0) lens, supporting 4x optical zoom. The front of the iPhone 11 Pro Max also integrates 3D structured light-based Face ID and a 12-megapixel selfie camera. Techinsights said that Sony is still the supplier of four visual cameras for iPhone 11 Pro Max, while ST Microelectronics has been the supplier of infrared camera chips in the iPhone's front structured light module for three consecutive years. ▲ Details of the iPhone 11 and iPhone 11 Pro Max cameras ▲Photo of the 12 MP rear wide-angle camera image sensor die (filter removed) ▲Photo of the 12 MP rear-facing ultra-wide-angle camera image sensor die (filter removed) ▲12 MP rear telephoto camera image sensor bare die photo (filter removed) ▲Photo of the 12 MP front camera image sensor die (filter removed) ▲Photo of the 1.4 MP front-facing infrared camera image sensor die Apple / Cirrus Logic 338S00509 audio codec and three Apple 338S00411 audio amplifiers. The iPhone 11 Pro Max also integrates the ST Microelectronics ST33G1M2 MCU, the NXP CBTL1612A1 display port multiplexer, and the Cypress CYPD2104 USB Type-C port controller. Editor: Core Intelligence - Rurouni Ken https://www.techinsights.com/blog/apple-iphone-11-pro-max-teardown https://www.techinsights.com/blog/apple-iphone-xs-max-teardown |
